a leading provider of semiconductor technology aimed at powering a smart,
secure, connected world, today announced collaboration with Sony® Corporation
Semiconductor Business Group for the first open market 3D-capable timing
controller plus local dimming solution for the manufacturing of
lower cost, high volume next-generation LCD TVs. The combined solution includes
a Sony timing and lighting controller, part number and the Microsemi LED driver
solution consisting of two chips, the DAZL series 32-port logic chip and 8-port
LED driver power chip.
The complete turn-key reference design draws on Sony’s powerful video and
light processing technology and Microsemi’s DAZL! LED drive technology, enabling
the production of superior, high quality 3D and 2D images using LCD panels from
a wide variety of manufacturers. The combined technologies allow lower cost 60
Hz refresh LCD panels to produce the image quality of more expensive 120 Hz
panels, and enable 120 Hz panels to match the image quality of costly state of
the art 240 Hz panels. TV designers, particularly in rapidly expanding markets
such as China, can now create 3D-enabled LCD TVs with enhanced image motion
quality and contrast ratio while reducing cost, simplifying design complexity
and shortening time to market. Microsemi is also planning to extend its
relationship with Sony to include support of Sony’s next generation of video and
light processing technology.
This joint effort has yielded an easy to adopt yet technologically advanced
solution for next-generation LED TVs,” said Paul Pickle, Corporate Vice
President and General Manager of Microsemi’s Analog Mixed Signal Group. “The
collaboration resulted in a complete turn-key solution supporting advanced
features such as scanning LED backlighting and 3D, greatly reducing development
time and cost for TV manufacturers.
Microsemi Corporation offers the industry’s most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system
challenges, Microsemi’s products include high-performance, high-reliability
analog and RF devices, mixed signal integrated circuits, FPGAs and customizable
SoCs, and complete subsystems.
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